Product sheet
The Mingseal MLS300 is a water-jet guided lasercutting system. The laser beam is guided inside a micrometric water jet by total internal reflection, for cutting that is contact-free, burr-free and with no heat-affected zone.
It is ideal for hard, brittle or high-value materials: ceramics, wafers, silicon carbide, boron nitride, carbon fibre and diamond. CDS Electronique is one of the few companies offering this technology.
Frame and motion axes that carry and position the workpiece.
Control cabinet with screen, managing the laser, water pressure and process.
Head that injects the laser beam into the micrometric water jet.
The laser beam is focused by a lens, passes through a glass window and is then injected into a micrometric water jet formed by a nozzle.
When the beam reaches the water / air interface at an angle below the critical angle, it undergoes total internal reflection : the laser remains guided inside the water column, as in an optical fibre.
By precisely controlling the focal spot size and the angle of incidence, the laser energy propagates stably and accurately along the jet, for high-quality, high-efficiency machining at the material surface.
Ultra-precise machining of brittle materials (ceramic substrates, wafers, thin alloy sheets) and hard materials (silicon carbide, boron nitride, carbon fibre, diamond), with a cutting depth/width ratio greater than 30:1.
No grinding or polishing: automatic calibration of the jet angle and regulation of water pressure to ± 0.1 MPa for excellent cut flatness.
Minimum kerf of 30 µm: less material lost on expensive materials.
The water flow removes heat in real time: heat-affected zone below 5 µm.
Contact-free machining: no mechanical stress, no tool wear and no contact-related contamination.
No dust or harmful gases during machining; the water jet removes debris directly and keeps the part clean.
CE certified and compliant with SEMI S2 safety standards.
The column framed in orange is our machine : the MLS300 water-jet guided laser, sold by CDS Electronique.
| Our machineMLS300 · CDS ElectroniqueWater-jet guided laser | Other technologyContinuous-wave laser | Other technologyUltrafast laser | |
|---|---|---|---|
| Heat-affected zone | ≤ 5 µm | > 500 µm | ≤ 5 µm |
| Depth / width ratio | ≥ 30:1 | 10:1 | 20:1 |
| Minimum kerf | 30 µm | > 100 µm | 50 to 100 µm |
| Cut taper | Virtually none | Pronounced | None up to 0.3 mm thickness, pronounced beyond |
| Burrs | None, no grinding or polishing | Clear burrs, grinding and polishing required | None up to 0.3 mm, pronounced beyond |
| Cleanliness | Debris removed by the water jet, clean part | Cleaning after machining (dust and slag) | Cleaning after machining (light dust) |
| Environment | No dust or harmful gases | Dust and harmful gases | Dust and harmful gases |
Aircraft engine parts, high-temperature sensor housings, structural parts, skin panels, reinforcements, turbine blades, combustion chamber liners.
Micro-scissors and forceps, precision surgical blades, endoscope parts, micro-pumps, cardiovascular stents.
Processor heat sinks, LED heat sinks, diamond films.
Insulating ceramics, carbon fibre hinges, liquid metal, augmented reality lenses.
IGBT and MOSFET power modules, bipolar plate channels, converter heat-dissipation substrates, lithium-ion battery electrodes.
Diamond cutting tools, diamond drills, diamond grinding wheels.
Typical processes
Micrometric accuracy, more than 30% better than traditional mechanical machining.
Efficient material removal: productivity +50 to 70%.
Heat-affected zone ≤ 5 µm: risk of thermal damage reduced by 90% compared with laser alone.
Defect-free machining of copper-based materials: defect rate reduced by 80% compared with traditional laser cutting.
Efficient diamond cutting, with a kerf reduced by more than 40%.
Multi-material machining: process integration +70%, copper bonding layer and diamond abrasive layer machined in a single operation.
Cutting trials on your own materials can be arranged. Contact us
Let's talk about your application
Tell us which fluid you dispense, at what rate and with what tolerance: we will propose the right configuration, a detailed quotation and, if you wish, a trial on your own parts in our laboratory.
CDS Electronique · Bussy-Saint-Martin (77) · Mon–Thu 9am–6pm · Fri 9am–12pm
